GB24_Fabrication and test components
Testing and assembly of components
Wire bonding
This type of technological realization consists in connecting two points of a device by thermocompression with a gold wire diameter of the order of a few tens micrometers by adjusting temperature levels, force and pressure depending on the material of the devices.
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Features:Method: Wedge Bonding Diameter of the gold wire: 25 μm Temperature controller: up to 250°C |
Possible Achievements:Compatible with gold, copper and aluminum pads Maximum wire length: 1 mm |
